发明申请
US20050147918A1 Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them
有权
光刻胶组合物，其硬化形式，其硬化图案和使用它们形成的金属图案
- 专利标题： Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them
- 专利标题（中）： 光刻胶组合物，其硬化形式，其硬化图案和使用它们形成的金属图案
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申请号： US11028455申请日： 2005-01-03
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公开(公告)号： US20050147918A1公开(公告)日： 2005-07-07
- 发明人: William Weber , Satoshi Mori , Nao Honda
- 申请人： William Weber , Satoshi Mori , Nao Honda
- 专利权人： MicroChem Corp. a corporation of the state of Massachusetts, US,Nippon Kayaku Co., Ltd., a corporation of Japan
- 当前专利权人： MicroChem Corp. a corporation of the state of Massachusetts, US,Nippon Kayaku Co., Ltd., a corporation of Japan
- 主分类号： G03C1/76
- IPC分类号： G03C1/76 ; G03F7/038 ; G03F7/40
摘要：
Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).