发明申请
- 专利标题： Alignment and orientation features for a semiconductor package
- 专利标题（中）： 半导体封装的对准和取向特征
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申请号： US11059593申请日： 2005-02-16
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公开(公告)号： US20050148116A1公开(公告)日： 2005-07-07
- 发明人: Stuart Roberts , William Reeder , Leonard Mess
- 申请人： Stuart Roberts , William Reeder , Leonard Mess
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/544 ; H01L21/48
摘要：
A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system
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