公开(公告)号：US20050148116A1

公开(公告)日：2005-07-07

申请号：US11059593

申请日：2005-02-16

申请人： Stuart Roberts ,  William Reeder ,  Leonard Mess

发明人： Stuart Roberts ,  William Reeder ,  Leonard Mess

IPC分类号： H01L23/495 ,  H01L23/544 ,  H01L21/48

CPC分类号： H01L23/544 ,  H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system

摘要翻译： 一种由自动引线接合系统形成的半导体器件。 半导体器件包括具有多个引线指和管芯焊盘的引线框架和安装到管芯焊盘的半导体管芯。 模板包括从模具延伸的多个眼点特征。 芯片包括第一多个接合焊盘，并且引线指包括第二多个接合焊盘。 第一和第二接合焊盘通过由自动引线接合系统安装的多个连接线互连。 引线接合系统获得引线框架的图像，并且识别图像内的管芯焊盘的眼点特征，以便更精确地确定引线框架的第二引线接合焊盘相对于引线接合系统的位置

公开(公告)号：US20080053964A1

公开(公告)日：2008-03-06

申请号：US11758554

申请日：2007-06-05

申请人： Stuart Roberts ,  Rich Fogal

发明人： Stuart Roberts ,  Rich Fogal

IPC分类号： B23K9/013

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L23/13 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00

摘要： Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method. It is emphasized that this Abstract is provided to comply with the rules requiring an abstract. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

摘要翻译： 引线接合器和引线接合方法在本文中公开。 在一个实施例中，一种方法包括将导线附接到微电子部件的端子并且在第一电极和第二电极之间产生电弧，以在至少接近第一和第二电极的点处切断电线。 在另一个实施例中，引线接合器包括具有毛细管，第一电极和第二电极的接合头，每个第一电极和第二电极相对于接合头设置，以及可操作地耦合到第一和第二电极的控制器。 控制器具有包含执行上述方法的指令的计算机可读介质。 要强调的是提供本摘要以符合要求摘要的规则。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

公开(公告)号：US20060125635A1

公开(公告)日：2006-06-15

申请号：US11340962

申请日：2006-01-26

申请人： Stuart Roberts ,  John Demetrops ,  Vladimir Schuster

发明人： Stuart Roberts ,  John Demetrops ,  Vladimir Schuster

IPC分类号： G08B13/14

CPC分类号： G08B13/1472 ,  G08B5/36

摘要： The invention relates to a method and system for monitoring tray activity in which a tray sensing device detects the presence of a tray in a given location. The tray can be a conventional tray for supporting food articles or can be supported or integral with a food cart. Information from the tray sensing device can be forwarded to a central information system. The central information system can display the information or activate an alarm. The alarm can be an audio or visual alert. The alarm can be deactivated upon removal of the tray from the given location or upon dispatching of personnel to the given location.

公开(公告)号：US20050029329A1

公开(公告)日：2005-02-10

申请号：US10635947

申请日：2003-08-06

申请人： Stuart Roberts ,  Rich Fogal

发明人： Stuart Roberts ,  Rich Fogal

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L23/13 ,  B23K1/06

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L23/13 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00

摘要： Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method. It is emphasized that this Abstract is provided to comply with the rules requiring an abstract. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

摘要翻译： 引线接合器和引线接合方法在本文中公开。 在一个实施例中，一种方法包括将导线附接到微电子部件的端子并且在第一电极和第二电极之间产生电弧，以在至少接近第一和第二电极的点处切断电线。 在另一个实施例中，引线接合器包括具有毛细管，第一电极和第二电极的接合头，每个第一电极和第二电极相对于接合头设置，以及可操作地耦合到第一和第二电极的控制器。 控制器具有包含执行上述方法的指令的计算机可读介质。 要强调的是提供本摘要以符合要求摘要的规则。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。