公开(公告)号：US20060205117A1

公开(公告)日：2006-09-14

申请号：US11434620

申请日：2006-05-15

申请人： Ford Grigg ,  William Reeder

发明人： Ford Grigg ,  William Reeder

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/13 ,  B33Y80/00 ,  H01L23/24 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A carrier (e.g., a carrier substrate, such as a circuit board, etc.) may be modified to include a solder mask on a surface thereof. The solder mask, which may extend to or beyond an edge of the carrier, includes an opening that exposes at least one contact area of the carrier. The opening of the solder mask is configured and positioned such that a conductive element (e.g., a bond wire), at least a portion of which extends laterally, that may protrude from the contact area will be at least partially laterally surrounded by the solder mask. A retention element may be secured to the solder mask, over the conductive element and a portion of the opening of the solder mask, with a portion of the opening remaining exposed beyond the retention element to facilitate the introduction of encapsulant material into the opening and around the conductive element. Assemblies that include these features and assembly methods are also disclosed.

摘要翻译： 可以修改载体（例如载体基板，例如电路板等），以在其表面上包括焊料掩模。 可以延伸到或超过载体边缘的焊接掩模包括露出载体的至少一个接触区域的开口。 焊接掩模的开口被构造和定位成使得其至少一部分横向延伸的导电元件（例如，接合线）可以从接触区域突出，至少部分地被阻焊膜横向包围 。 保持元件可以固定到焊料掩模上，在导电元件上和焊料掩模的开口的一部分上，其中一部分开口保持暴露在保持元件之外，以便于将密封剂材料引入开口和周围 导电元件。 还公开了包括这些特征和组装方法的组件。

公开(公告)号：US20060014313A1

公开(公告)日：2006-01-19

申请号：US10893022

申请日：2004-07-16

申请人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

发明人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  B33Y80/00 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

摘要翻译： 本文公开了微电子成像单元和用于制造微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯放置在支撑构件上。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在支撑构件上设置多个离散支架。 离散的支架相对于相应的成像管芯排列成阵列。 该方法还包括将成像管芯的外部触头电连接到支撑构件上的对应的端子，以及将多个盖子附接到相应的支架阵列，使盖子位于图像传感器上方。

公开(公告)号：US20070117249A1

公开(公告)日：2007-05-24

申请号：US11653861

申请日：2007-01-17

申请人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

发明人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  B33Y80/00 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

摘要翻译： 本文公开了微电子成像单元和用于制造微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯放置在支撑构件上。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在支撑构件上设置多个离散支架。 离散的支架相对于相应的成像管芯排列成阵列。 该方法还包括将成像管芯的外部触头电连接到支撑构件上的对应的端子，以及将多个盖子附接到相应的支架阵列，使盖子位于图像传感器上方。

公开(公告)号：US20050181545A1

公开(公告)日：2005-08-18

申请号：US11108151

申请日：2005-04-08

申请人： Ford Grigg ,  William Reeder

发明人： Ford Grigg ,  William Reeder

IPC分类号： H01L23/13 ,  H01L23/24 ,  H01L23/498 ,  H01L21/00 ,  H01L21/44 ,  H01L21/50 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/13 ,  B33Y80/00 ,  H01L23/24 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solder mask includes an opening through which intermediate conductive elements may be positioned between bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured and corresponding contact areas of the carrier substrate. An assembly is formed by forming the solder mask on or securing the solder mask to the carrier substrate. The semiconductor die is attached to the carrier substrate such that bond pads of the semiconductor die are exposed through the aligned openings in the carrier substrate and solder mask. Intermediate conductive elements are used to electrically connect the bond pads to corresponding contact areas on the carrier substrate. An encapsulant material is introduced into an area defined by the solder mask and carrier substrate openings such that the intermediate conductive elements and semiconductor die surface within the aligned openings are encapsulated.

摘要翻译： 焊接掩模包括开口，中间导电元件可以通过该开口定位在半导体管芯的接合焊盘之间，所述接合焊盘通过固定有焊料掩模的载体衬底中的对准开口和载体衬底的相应接触区域露出。 通过在焊料掩模上形成焊接掩模或将焊接掩模固定到载体基底上而形成组件。 将半导体管芯附着到载体衬底上，使得半导体管芯的接合焊盘通过载体衬底和焊接掩模中的对准的开口露出。 中间导电元件用于将接合焊盘电连接到载体衬底上相应的接触区域。 将密封剂材料引入到由焊料掩模和载体衬底开口限定的区域中，使得对准的开口内的中间导电元件和半导体管芯表面被封装。

公开(公告)号：US20050148116A1

公开(公告)日：2005-07-07

申请号：US11059593

申请日：2005-02-16

申请人： Stuart Roberts ,  William Reeder ,  Leonard Mess

发明人： Stuart Roberts ,  William Reeder ,  Leonard Mess

IPC分类号： H01L23/495 ,  H01L23/544 ,  H01L21/48

CPC分类号： H01L23/544 ,  H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system

摘要翻译： 一种由自动引线接合系统形成的半导体器件。 半导体器件包括具有多个引线指和管芯焊盘的引线框架和安装到管芯焊盘的半导体管芯。 模板包括从模具延伸的多个眼点特征。 芯片包括第一多个接合焊盘，并且引线指包括第二多个接合焊盘。 第一和第二接合焊盘通过由自动引线接合系统安装的多个连接线互连。 引线接合系统获得引线框架的图像，并且识别图像内的管芯焊盘的眼点特征，以便更精确地确定引线框架的第二引线接合焊盘相对于引线接合系统的位置