发明申请
- 专利标题： Position adjusting method and substrate processing system
- 专利标题（中）： 位置调整方法和基板处理系统
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申请号： US11029401申请日： 2005-01-06
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公开(公告)号： US20050150451A1公开(公告)日： 2005-07-14
- 发明人: Michio Tanaka , Masami Yamashita
- 申请人： Michio Tanaka , Masami Yamashita
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 优先权： JPJP2004-005726 20040113
- 主分类号： B05D3/00
- IPC分类号： B05D3/00 ; B05C11/00 ; B05C11/08 ; B05C11/10 ; G03C5/00 ; H01L21/00 ; H01L21/027 ; H01L21/68
摘要：
According to the present invention, in a coating treatment apparatus comprising a rotary holding member and a coating solution discharge member, positional adjustment of the holding position of the substrate with respect to the rotary holding member and a discharge position of a coating solution discharge member is quickly and accurately performed, so that the time required for the positional adjustment can be shortened. Further, variations in accuracy of the positional adjustment depending on the degree of proficiency of operator can be eliminated, realizing positional adjustment with a high precision at all times.
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