Acoustic transducers configured with integrated electronics technology are adapted to digitize signal data close to the transducer. The transducers are packaged with a reduced number of elements and sealed for exposure to harsh environments, without oil compensation. A transducer assembly includes a frame, an acoustic transducer element disposed on the frame, and an electronics module disposed on the frame and linked to the acoustic transducer element. The pressure and temperature tolerant electronics module is adapted to process a signal associated with the transducer element.