发明申请
US20050150932A1 Arrangement for wire bonding and method for producing a bonding connection
审中-公开
引线接合的结构和接合连接的制造方法
- 专利标题： Arrangement for wire bonding and method for producing a bonding connection
- 专利标题（中）： 引线接合的结构和接合连接的制造方法
-
申请号： US10504246申请日： 2003-02-05
-
公开(公告)号： US20050150932A1公开(公告)日： 2005-07-14
- 发明人: Khalil Hosseini
- 申请人： Khalil Hosseini
- 优先权： DE102056099 20020211
- 国际申请： PCT/DE03/00325 WO 20030205
- 主分类号： B23K20/00
- IPC分类号： B23K20/00 ; B23K20/10 ; B23K26/20 ; B23K31/02
摘要：
The invention relates to a wire-bonding process and to a process for producing a bonded joint. A bonding location is heated by means of a laser beam originating from a laser, the arrangement comprising an ultrasonic wedge-wedge bonding unit with a bonding needle, a copper or aluminum bonding wire guide, and a copper or aluminum wire for an ultrasonic wedge-wedge bonding process, and at least one of the bonding locations having a hard-metal coating.
信息查询
