发明申请
- 专利标题: Laser machining apparatus
- 专利标题(中): 激光加工设备
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申请号: US11037222申请日: 2005-01-19
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公开(公告)号: US20050161445A1公开(公告)日: 2005-07-28
- 发明人: Kazuhisa Ishii , Fumio Watanabe
- 申请人: Kazuhisa Ishii , Fumio Watanabe
- 优先权: JP2004-012425 20040120
- 主分类号: G02B26/08
- IPC分类号: G02B26/08 ; B23K20/04 ; B23K20/08 ; B23K26/00 ; B23K26/04 ; H01S3/10
摘要:
There is provided a laser machining apparatus that excels in precision in terms of machining position and shape. The laser machining apparatus is provided with an optical axis adjusting unit disposed on a basal optical axis of a laser beam outputted from a laser oscillator so as to adjust the laser beam outputted from the laser oscillator onto a workpiece. The laser machining apparatus is provided further with mirrors, disposed between the laser oscillator and the optical axis adjusting unit, for freely deflecting the optical axis of the laser beam; and optical axis position detecting means, disposed between the optical axis adjusting unit and the optical axis deflecting means, for detecting the position of the optical axis of the laser beam. The apparatus aligns the optical axis of the laser beam incident on the optical axis adjusting unit with the basal optical axis by means of the mirrors based on a result detected by the optical axis position detecting means.
公开/授权文献
- US07473867B2 Laser machining apparatus 公开/授权日:2009-01-06
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