The present invention provides a lighting head assembly that incorporates a high intensity LED package into an integral housing for further incorporation into other useful lighting devices. The present invention provides for the LED to be installed onto a circuit board that also includes a clad layer formed thereon that acts as a spreader plate. When the circuit board is in mated relation with a thermally conductive reflector cup, the clad heat spreader serves to conduct heat from the led into the reflector cup. In this manner, high intensity LED packages can be incorporated into lighting assemblies through the use of the present invention by simply installing the present invention into a housing and providing power connections thereto.