The invention is directed to correcting of a lower end level of a suction nozzle during manufacturing running based on the lower end level of the suction nozzle measured after a mounting operation. An electronic component mounting apparatus for picking electronic components up from component feeding units by suction nozzles and mounting the electronic component on a printed board is provided with a line sensor unit for measuring a lower end level of the suction nozzle after a component mounting operation on a printed board. A CPU calculates a descending amount of the suction nozzle at a pickup station and a mounting station based on a value measured by the line sensor unit, and rotates a stroke motor to move a moving body to a position where the suction nozzle can descend by the amount. Therefore, the electronic component can be picked up and mounted on the printed board properly even if the suction nozzle is worn with time.