发明申请
US20050168731A1 Method for analyzing defect data and inspection apparatus and review system
失效
分析缺陷数据和检查仪器和审查系统的方法
- 专利标题： Method for analyzing defect data and inspection apparatus and review system
- 专利标题（中）： 分析缺陷数据和检查仪器和审查系统的方法
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申请号： US11095614申请日： 2005-04-01
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公开(公告)号： US20050168731A1公开(公告)日： 2005-08-04
- 发明人: Hisae Shibuya , Yuji Takagi
- 申请人： Hisae Shibuya , Yuji Takagi
- 优先权： JP2001-110794 20010410; JP2001-173411 20010608; JP2001-292786 20010926
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01N21/95 ; G06T7/00 ; G01N21/88
摘要：
The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
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