摘要:
An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
摘要:
A visual inspection method and apparatus detecting a defect with the use of a detected signal obtained by illuminating one of a light and an electron beam onto a substrate to be inspected. The visual inspection method and apparatus includes calculation of an image feature based on an image of the detected defect, calculation of a coordinate feature based on position information of the detected defect, and outputting of real defect information by performing false alarm judgment by processing with respect to one of the image feature and the coordinate feature.
摘要:
To allow early sensing of anomalies in a manufacturing plant or other infrastructure (plant), provided is a method that acquires data of runtime status of said plant from a plurality of sensors of said plant, makes a model from training data that corresponds to the regular runtime status of said plant, employs the training data thus modeled in computing a anomaly measure of the data acquired from the sensors, and detects anomalies. In computing the anomaly measure, the anomaly is detected by recursively carrying out: a derivation of a residual error from the training data thus modeled acquired from the plurality of sensors, a removal of a signal having a residual error that is greater than a predetermined value, and a computation of the anomaly measure for the data that is acquired from the plurality of sensors whereupon the signal having the large residual error is removed.
摘要:
In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes means of detecting a statistical offset value from the feature amount to be a defect, thereby enabling the defect to be properly detected even when a brightness difference is occurring in association with film a thickness difference in a wafer.
摘要:
In order to provide a method and system for anomaly detection/diagnosis that can detect anomalies quickly and with high sensitivity in a machinery such as a plant, in the present disclosures, sets of maintenance record information comprising operational records, replacement part information and other past cases are associated with each other on a keyword basis, anomalies are detected on the basis of anomaly detection that targets the output signal of a multidimensional sensor attached to the machinery, and by means of connecting the detected anomaly with the associated maintenance record information, the required diagnosis/measures with respect to the anomaly that has arisen are elucidated.
摘要:
A method and system for detecting an anomaly or a fault in equipment such as a plant. A method of representing the state of the equipment is offered. Output signals from multidimensional sensors are treated as subjects. (1) Normal learning data is created. (2) An anomaly measurement is calculated by a subspace classifier or other method. (3) Trajectories of motions of observational data and learning data are evaluated and their errors are calculated by a linear prediction method or the like. (4) The state of the equipment is represented using the anomaly measurement and the trajectories of the motions. (5) A decision is made regarding an anomaly. A case-based reasoning anomaly detection consists of modeling the learning data by the subspace classifier and detecting candidate anomalies based on the distance relationship between the observational data and the subspace. The trajectories of the motions are based on modeling using a linear prediction method.
摘要:
Anomaly sign detection methods such as those found in plants cannot detect anomalies when relevant sensor information is not acquired, and while it is possible to detect anomalies through changes in sensor output when manual operations are performed, it is difficult to distinguish between anomalies such as those caused only by the sensor signal and actual anomalies which should be detected. The disclosed method uses event signals, which contain a signal based on the status of a unit unable to acquire sensor information and a signal based on human operations. An event sequence is extracted from an event signal outputted from a piece of equipment and grouped by clustering, then a frequency matrix is created for the alarms generated within a prescribed interval of an event sequence, and a prediction of alarms with a high probability of occurring for an event sequence is output on the basis of the frequency matrix.
摘要:
When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.
摘要:
Provided are a method which permits complete training data and data with added errors, and enables the early and accurate discovery of errors in facilities such as a plant, and a system thereof. To achieve the objectives, (1) the behavior of temporal data is observed over time, and the trace is divided into clusters; (2) the divided cluster groups are modeled in sub spaces, and the discrepancy values are calculated as errors candidates; (3) the training data are used (compare, reference, etc.) for reference to determine the state transitions caused by the changes over time, the environmental changes, the maintenance (parts replacement), and the operation states; and (4) the modeling is a sub space method such as regression analysis or projection distance method of every N data removing N data items, (N=0, 1, 2, . . . ) (for example, when N=1, one error data item is considered to have been added, this data is removed, then the modeling is performed), or a local sub space method. Linear fitting in regression analysis is equivalent to the lowest order regression analysis.
摘要:
In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes means of detecting a statistical offset value from the feature amount to be a defect, thereby enabling the defect to be properly detected even when a brightness difference is occurring in association with film a thickness difference in a wafer.