发明申请
US20050170650A1 Electroless palladium nitrate activation prior to cobalt-alloy deposition
审中-公开
在钴合金沉积之前的无电解硝酸钯活化
- 专利标题: Electroless palladium nitrate activation prior to cobalt-alloy deposition
- 专利标题(中): 在钴合金沉积之前的无电解硝酸钯活化
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申请号: US10970354申请日: 2004-10-21
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公开(公告)号: US20050170650A1公开(公告)日: 2005-08-04
- 发明人: Hongbin Fang , Ramin Emami , Timothy Weidman , Arulkumar Shanmugasundram , Fang Mei
- 申请人: Hongbin Fang , Ramin Emami , Timothy Weidman , Arulkumar Shanmugasundram , Fang Mei
- 主分类号: H01L21/302
- IPC分类号: H01L21/302 ; H01L21/461
摘要:
In one embodiment, a method for activating a metal layer prior to depositing a cobalt-containing capping layer is provided which includes exposing the metal layer to an electroless activation solution to deposit a palladium layer on the metal layer and depositing the cobalt-containing capping layer on the palladium layer. The electroless activation solution contains palladium nitrate at a concentration in a range from about 0.01 mM to about 1.0 mM, nitric acid at a concentration in a range from about 0.01 mM to about 3.0 mM and water. In another embodiment, the electroless activation solution contains palladium nitrate at a concentration in a range from about 0.01 mM to about 1.0 mM, methanesulfonic acid at a concentration in a range from about 0.01 mM to about 3.0 mM and water.
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