- 专利标题： Ball transferring method and apparatus
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申请号： US11094051申请日： 2005-03-30
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公开(公告)号： US20050176176A1公开(公告)日： 2005-08-11
- 发明人: Kenji Shimokawa , Eiji Hashino , Kohei Tatsumi
- 申请人： Kenji Shimokawa , Eiji Hashino , Kohei Tatsumi
- 申请人地址： JP Tokyo
- 专利权人： Nippon Steel Corporation
- 当前专利权人： Nippon Steel Corporation
- 当前专利权人地址： JP Tokyo
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/60 ; H01L21/683 ; H05K3/34 ; H01L21/00 ; B23K5/00 ; H01L21/50 ; B23K1/00 ; B23K35/12 ; H01L21/44 ; B23K20/14
摘要：
Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily arranged balls or alternatively the temporarily arranged balls are sucked, so as to remove excess balls other than balls that have been exactly sucked onto the ball arrangement region. Cooperation with application of fine vibration to the carrier board makes the removal of the excess balls more efficient.
公开/授权文献
- US07285486B2 Ball transferring method and apparatus 公开/授权日：2007-10-23
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