- 专利标题： IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless
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申请号： US11097136申请日： 2005-04-04
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公开(公告)号： US20050179121A1公开(公告)日： 2005-08-18
- 发明人: Junichi Tanaka , Hiroyuki Takubo , Shigenobu Abe
- 申请人： Junichi Tanaka , Hiroyuki Takubo , Shigenobu Abe
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 优先权： JP2002-167159 20020607; JP2002-355108 20021206
- 主分类号： B42D15/10
- IPC分类号： B42D15/10 ; G06K17/00 ; G06K19/07 ; G06K19/077 ; H05K1/02 ; H05K3/20 ; H05K3/32 ; H05K3/34 ; H01L23/495
摘要：
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.
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