发明申请
- 专利标题： Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition
- 专利标题（中）： 使用该组合物制造的导热性可固化液体聚合物组合物和半导体器件
-
申请号： US10511659申请日： 2003-05-29
-
公开(公告)号： US20050181213A1公开(公告)日： 2005-08-18
- 发明人: Hiroki Ishikawa , Katsutoshi Mine , Kimio Yamakawa , Kazumi Nakayoshi
- 申请人： Hiroki Ishikawa , Katsutoshi Mine , Kimio Yamakawa , Kazumi Nakayoshi
- 国际申请： PCT/JP03/06798 WO 20030529
- 主分类号： C08K3/08
- IPC分类号： C08K3/08 ; C08K3/22 ; C08L83/04 ; C09K5/14 ; H01L23/373 ; B32B27/38 ; B32B9/04 ; C08L63/00
摘要：
A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.
公开/授权文献
信息查询
