Invention Application
- Patent Title: Joining method by Au-Sn brazing material
- Patent Title (中): 焊接方法采用Au-Sn钎焊材料
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Application No.: US11055945Application Date: 2005-02-11
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Publication No.: US20050184135A1Publication Date: 2005-08-25
- Inventor: Kenichi Miyazaki
- Applicant: Kenichi Miyazaki
- Assignee: Tanaka Kikinzoku Kogyo K.K.
- Current Assignee: Tanaka Kikinzoku Kogyo K.K.
- Priority: JPP2004-044600 20040220
- Main IPC: B23K35/00
- IPC: B23K35/00 ; B23K35/30 ; C22C5/02 ; B23K31/02

Abstract:
The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %.
Public/Granted literature
- US07114644B2 Joining method by Au-Sn brazing material Public/Granted day:2006-10-03
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