Invention Application
- Patent Title: Interconnect system without through-holes
- Patent Title (中): 互连系统无通孔
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Application No.: US11055578Application Date: 2005-02-09
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Publication No.: US20050189640A1Publication Date: 2005-09-01
- Inventor: Kevin Grundy , Joseph Fjelstad , Gary Yasumura , William Wiedemann , Para Segaram
- Applicant: Kevin Grundy , Joseph Fjelstad , Gary Yasumura , William Wiedemann , Para Segaram
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/13 ; H01L23/31 ; H01L25/10 ; H05K1/18 ; H05K3/40
Abstract:
Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
Public/Granted literature
- US07652381B2 Interconnect system without through-holes Public/Granted day:2010-01-26
Information query
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