发明申请
- 专利标题: Semiconductor device with heterojunction
- 专利标题(中): 具有异质结的半导体器件
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申请号: US11068803申请日: 2005-03-02
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公开(公告)号: US20050199873A1公开(公告)日: 2005-09-15
- 发明人: Hideaki Tanaka , Masakatsu Hoshi , Tetsuya Hayashi
- 申请人: Hideaki Tanaka , Masakatsu Hoshi , Tetsuya Hayashi
- 专利权人: NISSAN MOTOR CO., LTD.
- 当前专利权人: NISSAN MOTOR CO., LTD.
- 优先权: JPP2004-065474 20040309
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/336 ; H01L29/06 ; H01L29/12 ; H01L29/24 ; H01L29/267 ; H01L29/47 ; H01L29/732 ; H01L31/0328 ; H01L31/0336 ; H01L31/072 ; H01L31/109
摘要:
An aspect of the present invention provides a semiconductor device that includes a semiconductor base made of a first semiconductor material of a first conductivity type, a hetero-semiconductor region forming a heterojunction with the semiconductor base and made of a second semiconductor material having a different band gap from the first semiconductor material, a first gate electrode arranged in the vicinity of the heterojunction, a first gate insulating film configured to insulate the first gate electrode from the semiconductor base, a source electrode formed in contact with the hetero-semiconductor region, a dram electrode formed in contact with the semiconductor base, and an electric field extending region partly facing the first gate electrode, the first gate insulating film and hetero-semiconductor region interposed between the electric field extending region and the first gate electrode, the electric field extending region extending a built-in electric field into the hetero-semiconductor region.
公开/授权文献
- US07061027B2 Semiconductor device with heterojunction 公开/授权日:2006-06-13
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