发明申请
- 专利标题: Carrier module
- 专利标题(中): 运营商模块
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申请号: US10797073申请日: 2004-03-11
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公开(公告)号: US20050200000A1公开(公告)日: 2005-09-15
- 发明人: Chul Ham , Byoung Lee , Ho Song , Young Park
- 申请人: Chul Ham , Byoung Lee , Ho Song , Young Park
- 专利权人: Mirae Corporation
- 当前专利权人: Mirae Corporation
- 主分类号: H01L29/74
- IPC分类号: H01L29/74
摘要:
Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch to move, and a second elastic member for elastic supporting of the latch buttons on the carrier module body, thereby, when the semiconductor device is brought into contact with the test socket, and tested, holding the semiconductor device with a vacuum formed through the pass through hole in the carrier module body and the vacuum tube in a state the latch releases the semiconductor device.
公开/授权文献
- US07061101B2 Carrier module 公开/授权日:2006-06-13