公开(公告)号：US20050200000A1

公开(公告)日：2005-09-15

申请号：US10797073

申请日：2004-03-11

申请人： Chul Ham ,  Byoung Lee ,  Ho Song ,  Young Park

发明人： Chul Ham ,  Byoung Lee ,  Ho Song ,  Young Park

IPC分类号： H01L29/74

CPC分类号： G01R31/2893

摘要： Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch to move, and a second elastic member for elastic supporting of the latch buttons on the carrier module body, thereby, when the semiconductor device is brought into contact with the test socket, and tested, holding the semiconductor device with a vacuum formed through the pass through hole in the carrier module body and the vacuum tube in a state the latch releases the semiconductor device.

摘要翻译： 载体模块包括用于将半导体器件放置在其下侧上的载体模块体，其具有从半部装置所在的上部到下侧的通孔，载体模块主体上的壳体，安装在其中的辅助壳体 壳体的下部能够在上下方向上移动，通过安装在壳体内部的第一弹性构件与载体模块主体弹性接触，辅助壳体中的真空管与通孔连通 载体模块主体中的至少一个闩锁，载体模块主体的下部中的至少一对闩锁，用于在外侧或内侧上分开或关闭，用于保持或释放位于载体模块主体上的半导体器件，闩锁 按钮装配在载体模块主体的上部，以便能够在上/下方向上移动，并且通过一个连接销连接到闩锁上，该连接销通过一个外部的forc在上/下方向上移动 e，使闩锁移动;以及第二弹性构件，用于弹性地支撑载体模块主体上的闩锁按钮，由此当半导体器件与测试插座接触并进行测试时，将半导体器件保持在 在闩锁释放半导体器件的状态下通过载体模块体中的通孔形成的真空和真空管。

公开(公告)号：US20060192583A1

公开(公告)日：2006-08-31

申请号：US11235248

申请日：2005-09-27

申请人： Chul Ham ,  Ho Song ,  Young Park ,  Jae Seo

发明人： Chul Ham ,  Ho Song ,  Young Park ,  Jae Seo

IPC分类号： G01R31/26

CPC分类号： G01R1/04 ,  G01R31/2893

摘要： A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability. The test tray includes a frame, pockets mounted to the frame while being uniformly spaced apart from one another, each of the pockets including a seat on which a semiconductor device is to be seated, latches mounted to the frame to be arranged in pairs for respective pockets such that the latches of each latch pair face each other at opposite sides of an associated one of the pockets, respectively, each of the latches being movable between a first position where the latch holds a semiconductor device seated in the seat of the associated pocket and a second position where the latch releases the held state of the semiconductor device, and latch operating members each mounted to the frame, and adapted to move an associated one of the latches between the first position and the second position, each of the latch operating members being separate from the associated latch.

摘要翻译： 公开了一种用于测试半导体器件的处理器的测试盘，其能够降低更换载体模块所需的成本和时间，并且实现可加工性的提高。 测试托盘包括框架，在彼此均匀间隔地安装到框架上的袋子，每个凹穴包括座，半导体装置将要安置在其上，安装到框架的闩锁成对布置成相应的 每个闩锁组的闩锁分别在相关联的一个凹穴的相对侧彼此面对，每个闩锁可在第一位置和第二位置之间移动，该第一位置之间闩锁保持坐在相关联的口袋的座中的半导体器件 以及第二位置，其中所述闩锁释放所述半导体器件的保持状态，以及锁定每个安装到所述框架的操作构件，并且适于在所述第一位置和所述第二位置之间移动相关联的一个闩锁，所述闩锁操作 构件与相关联的闩锁分离。

公开(公告)号：US20060119345A1

公开(公告)日：2006-06-08

申请号：US11200014

申请日：2005-08-10

申请人： Chul Ham ,  Woo Lim ,  Young Park ,  Ho Song

发明人： Chul Ham ,  Woo Lim ,  Young Park ,  Ho Song

IPC分类号： G01R31/28

CPC分类号： G01R31/2893

摘要： The present invention relates to a transfer device of a handler for testing semiconductor device in which a pitch between each head of picker heads may be adjusted to the discretionary one as wanted without replacing a cam plate. The transfer device of a handler for testing semiconductor device comprises a base part, a plurality of picker heads mounted movable horizontally on the base part for securing/detaching the semiconductors, a cam plate movably mounted on the base part, a plurality of cam grooves formed inclined therein, connection parts, wherein each first side thereof is secured to each picker head and each second side thereof is relative-movably connected to each cam groove, thereby connecting each picker head with each cam groove, and a driving unit for reciprocating the cam plate so as that the picker heads may be varied to a discretionary position of the base part.

摘要翻译： 本发明涉及一种用于半导体器件测试的处理器的传送装置，其中拾取器头部的每个头部之间的间距可根据需要调节到任意尺寸，而不需更换凸轮板。 用于测试半导体器件的处理器的传送装置包括基座部分，安装在基座上水平移动以固定/拆卸半导体的多个拾取头，可移动地安装在基座部分上的凸轮板，形成多个凸轮槽 在其中倾斜的连接部件，其中每个第一侧被固定到每个拾取器头部，并且其每个第二侧部可相对运动地连接到每个凸轮槽，从而将每个拾取器头部与每个凸轮槽连接，以及用于使凸轮往复运动的驱动单元 使得拾取器头可以变化到基部的任意位置。

公开(公告)号：US20070152655A1

公开(公告)日：2007-07-05

申请号：US11713683

申请日：2007-03-05

申请人： Chul Ham ,  Ho Song ,  Young Park ,  Woo Lim ,  Jae Seo

发明人： Chul Ham ,  Ho Song ,  Young Park ,  Woo Lim ,  Jae Seo

IPC分类号： G01R31/28

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

公开(公告)号：US20060170412A1

公开(公告)日：2006-08-03

申请号：US11196238

申请日：2005-08-04

申请人： Chan Park ,  Chul Ham ,  Young Park ,  Ho Song ,  Woo Lim ,  Jae Seo

发明人： Chan Park ,  Chul Ham ,  Young Park ,  Ho Song ,  Woo Lim ,  Jae Seo

IPC分类号： G01R31/28

CPC分类号： G01R1/0433

摘要： The present invention relates to a socket assembly for testing semiconductor device comprising a socket board electrically connected to an outside testing device wherein a plurality of connection pins connected to leads of a semiconductor is provided; a socket guide mounted to cover the socket board, with an open part formed so that the semiconductor may in/out, thereby connecting the semiconductor to the connection pins of the socket board; and a spacer interposed between the socket board and the socket guide for maintaining a predetermined distance between the semiconductor and the socket board by touching an surface of the semiconductor having moved into an inside of the socket guide before a surface of each carrier touches the socket guide. According to the present invention, the balls or the leads of each semiconductor may be pressed to the connection pins of the socket in a predetermined depth without replacing the carriers though the semiconductors have the different thicknesses.

摘要翻译： 本发明涉及一种用于测试半导体器件的插座组件，包括：电连接到外部测试装置的插座板，其中提供连接到半导体引线的多个连接引脚; 安装成覆盖插座板的插座引导件，其形成为使得半导体可以进/出的开口部，从而将半导体连接到插座板的连接引脚; 以及插入在插座板和插座引导件之间的间隔件，用于通过在每个承载件的表面接触插座导向件之前触摸已经移动到插座导向件内部的半导体的表面来保持半导体和插座板之间的预定距离 。 根据本发明，通过半导体具有不同的厚度，每个半导体的球或引线可以以预定深度被压到插座的连接销上，而不需要更换载体。