发明申请
- 专利标题： Semiconductor device, semiconductor package, and method for testing semiconductor device
- 专利标题（中）： 半导体器件，半导体封装和半导体器件测试方法
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申请号： US11124262申请日： 2005-05-09
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公开(公告)号： US20050200005A1公开(公告)日： 2005-09-15
- 发明人: Hiroyuki Tanaka , Yoshito Ito , Akinori Sekiyama
- 申请人： Hiroyuki Tanaka , Yoshito Ito , Akinori Sekiyama
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 优先权： JP2002-187994 20020627
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; G01R31/28 ; G01R31/317 ; G01R31/319 ; H01L21/82 ; H01L21/822 ; H01L23/544 ; H01L25/065 ; H01L25/07 ; H01L25/18 ; H01L27/04 ; H01L23/34
摘要：
A semiconductor device designed to facilitate testing. Superimposed first and second semiconductor chips each include a plurality of internal terminals, an external terminal, and a plurality of transistors. A plurality of wires connect the internal terminals, the transistors, and the external terminals of the first and second semiconductor chips in series.
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