发明申请
- 专利标题： Device for reactive sputtering
- 专利标题（中）： 反应溅射装置
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申请号： US10918749申请日： 2004-08-12
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公开(公告)号： US20050211550A1公开(公告)日： 2005-09-29
- 发明人: Thomas Fritz , Gunter Kemmerer
- 申请人： Thomas Fritz , Gunter Kemmerer
- 优先权： DE102004014855.4 20040326
- 主分类号： C23C14/34
- IPC分类号： C23C14/34 ; C23C14/00 ; C23C14/54 ; C23C14/56
摘要：
A device for reactive sputtering, wherein a cathode is applied a discharge voltage for a plasma, and a working gas and a reactive gas are introduced into a sputter chamber. The total gas flow in the sputter chamber is controlled with the aid of a valve, while the ratio of the partial pressures of both gases is kept constant.
公开/授权文献
- US2687752A Tool for applying fastening means 公开/授权日：1954-08-31
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