发明申请
- 专利标题： Bonded wafer processing method
- 专利标题（中）： 粘合晶片加工方法
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申请号： US10811758申请日： 2004-03-29
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公开(公告)号： US20050215056A1公开(公告)日： 2005-09-29
- 发明人: Patrick Morrow , R. List , Michael Chan
- 申请人： Patrick Morrow , R. List , Michael Chan
- 主分类号： H01L21/18
- IPC分类号： H01L21/18 ; H01L21/302 ; H01L21/304 ; H01L21/762
摘要：
According to one embodiment a method is disclosed. The method includes applying a photoresist layer to a first wafer, etching the first wafer, bonding the first wafer to a second wafer and thinning the first wafer; wherein an unsupported bevel portion of the first wafer is removed.
公开/授权文献
- US07129172B2 Bonded wafer processing method 公开/授权日：2006-10-31