发明申请
- 专利标题： Selective processing of microelectronic workpiece surfaces
- 专利标题（中）： 微电子工件表面的选择性处理
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申请号： US11133909申请日： 2005-05-21
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公开(公告)号： US20050217707A1公开(公告)日： 2005-10-06
- 发明人: Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
- 申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
- 主分类号： B08B3/00
- IPC分类号： B08B3/00 ; B44C1/22 ; H01L21/00 ; H01L21/302 ; H01L21/311 ; H01L21/3213
摘要：
A processing fluid is selectively applied or excluded from an outer peripheral margin of the front side, back side, or both sides of a workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece is spinning. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
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