发明申请
- 专利标题： Polishing apparatus and method of polishing a subject
- 专利标题（中）： 抛光装置和抛光对象的方法
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申请号： US11088786申请日： 2005-03-25
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公开(公告)号： US20050221724A1公开(公告)日： 2005-10-06
- 发明人: Takahiro Terada , Masaomi Nakahata , Yasutada Nakagawa
- 申请人： Takahiro Terada , Masaomi Nakahata , Yasutada Nakagawa
- 优先权： JP2004-089296 20040325
- 主分类号： B24B37/00
- IPC分类号： B24B37/00 ; B24B57/02 ; H01L21/304 ; B24B1/00
摘要：
A polishing apparatus. The polishing apparatus has an abrasive cloth and a table to rotate the abrasive cloth. A holder holds a subject to be polished against the abrasive cloth. A discharger discharges a polishing solution from the abrasive cloth after the polishing solution passes between the abrasive cloth and the subject.
信息查询
