摘要:
A polishing apparatus. The polishing apparatus has an abrasive cloth and a table to rotate the abrasive cloth. A holder holds a subject to be polished against the abrasive cloth. A discharger discharges a polishing solution from the abrasive cloth after the polishing solution passes between the abrasive cloth and the subject.
摘要:
According to one embodiment, a press apparatus for an electrode, includes, a press unit configured to compress an electrode sheet includes a first region formed with an electrode layer on a surface thereof and a second region on which the electrode layer is not formed, and a stretching unit includes a stretching member, which comprises a projecting surface located opposite the electrode sheet and projecting toward the electrode sheet, in a position corresponding to the second region, a retracted surface retracted from the electrode sheet relative to the projecting surface, in a position corresponding to the first region, and a relief surface retracted away from the electrode sheet, in a position corresponding to an edge portion of the electrode sheet.
摘要:
An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.
摘要:
An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.
摘要:
An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.
摘要:
An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.
摘要:
An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.
摘要:
According to one embodiment, a double-sided coating apparatus includes a first coating head arranged on one side of a raw material to coat the one side with a coating liquid by alternately forming a coating region and a non-coating region in a direction crossing a delivery direction, a second coating head arranged on the other side of the raw material to coat the other side with the coating liquid by alternately forming the coating region and the non-coating region in the direction crossing the delivery direction, and a coating roller arranged near a position on the one side of the raw material and opposite to the second coating head across the raw material and having a large-diameter portion and a small-diameter portion with different diameters along an axial direction with the small-diameter portion opposite to the coating region and the large-diameter portion opposite to the non-coating region.
摘要:
According to one embodiment, a double-sided coating apparatus includes a transport mechanism configured to convey the substrate, a first coating head disposed on one surface side of the substrate and configured to apply the coating liquid to the coated and uncoated regions, a second coating head disposed on the other surface side of the substrate and configured to apply the coating liquid to the coated and uncoated regions, and a coating roll disposed on the one surface side of the substrate and near a position where the coating roll is opposed to the second coating head with the substrate therebetween and includes first rollers disposed on axially opposite portions, at least one second roller disposed between the first rollers, and a rotation mechanism configured to rotate the first and second rollers such that the peripheral speed of the first rollers is higher than that of the second roller.
摘要:
An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.