发明申请
- 专利标题： Method and apparatus for electroplating
- 专利标题（中）： 电镀方法和装置
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申请号： US10814175申请日： 2004-04-01
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公开(公告)号： US20050224359A1公开(公告)日： 2005-10-13
- 发明人: Hung-Wen Su , Chien-Hsueh Shih , Ming-Hsing Tsai
- 申请人： Hung-Wen Su , Chien-Hsueh Shih , Ming-Hsing Tsai
- 主分类号： C25D5/00
- IPC分类号： C25D5/00 ; C25D7/12 ; C25D17/00 ; C25D17/02 ; H01L21/288
摘要：
Apparatus and method for metal electroplating. The apparatus for metal electroplating includes an electroplating tank for containing an electrolyte at a first temperature, a substrate holder for holding a semiconductor substrate, and a heater for heating the portion of the electrolyte adjacent to the substrate holder to a second temperature higher than the first temperature.
公开/授权文献
- US07476306B2 Method and apparatus for electroplating 公开/授权日：2009-01-13