发明申请
- 专利标题： Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece
- 专利标题（中）： 制造具有电路侧接触片和测试板侧接触片的半导体器件测试接触器的方法
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申请号： US11147167申请日： 2005-06-08
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公开(公告)号： US20050225342A1公开(公告)日： 2005-10-13
- 发明人: Shigeyuki Maruyama , Hirohisa Matsuki
- 申请人： Shigeyuki Maruyama , Hirohisa Matsuki
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2000-080974 20000322
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; G01R1/04 ; G01R1/073 ; H01L21/66 ; H01R11/01 ; H01R33/76 ; H01R43/00 ; H05K3/32 ; H01L21/302
摘要：
A contactor is placed between a semiconductor device and a test board. A contact electrode of the contactor electrically connects the semiconductor device to the test board. The contact electrode is formed of a conductive layer provided on an insulating substrate. The contact electrode comprises a first contact piece which contacts a terminal of the semiconductor device, a second contact piece which contacts an electrode of the test board, and a connecting portion which electrically connects the first contact piece and the second contact piece.