发明申请
- 专利标题： Electronic component, mounted structure, electro-optical device, and electronic device
- 专利标题（中）： 电子部件，安装结构，电光装置和电子装置
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申请号： US11103412申请日： 2005-04-11
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公开(公告)号： US20050230773A1公开(公告)日： 2005-10-20
- 发明人: Atsushi Saito , Shuichi Tanaka
- 申请人： Atsushi Saito , Shuichi Tanaka
- 优先权： JP2004-121645 20040416
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H01L23/485 ; H01L31/0203
摘要：
An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.
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