公开(公告)号：US20050062153A1

公开(公告)日：2005-03-24

申请号：US10914121

申请日：2004-08-10

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H05K3/28 ,  H01B1/24 ,  H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H01L23/48

CPC分类号： H05K3/325 ,  H01L23/49816 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/07811 ,  H01L2924/12044 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00

摘要： To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

摘要翻译： 为了提供电子部件的低成本安装结构，并且增加突起电极和形成在基板上的端子之间的导电连接的可靠性，在电子部件的安装结构中，凸块电极包括由 内部树脂和覆盖芯的表面的导电膜。 凸起电极直接与端子导电接触，并且以平面方式弹性变形以与基板的表面接触。 密封树脂填充在凸起电极和端子之间的导电接触部分周围，以保持凸起电极和端子。

公开(公告)号：US07166920B2

公开(公告)日：2007-01-23

申请号：US11103412

申请日：2005-04-11

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

摘要翻译： 一种电子部件，其通过活性表面上的焊盘与相对基板电连接，其特征在于，所述有源面上的树脂凸块和所述树脂凸块上的导电膜构成凸起电极，并且多个凸块电极为电气 连接到一个垫。

公开(公告)号：US07122896B2

公开(公告)日：2006-10-17

申请号：US10914121

申请日：2004-08-10

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/48 ,  H01L29/40 ,  B23K31/02

CPC分类号： H05K3/325 ,  H01L23/49816 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/07811 ,  H01L2924/12044 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00

摘要： To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

摘要翻译： 为了提供电子部件的低成本安装结构，并且增加突起电极和形成在基板上的端子之间的导电连接的可靠性，在电子部件的安装结构中，凸块电极包括由 内部树脂和覆盖芯的表面的导电膜。 凸起电极直接与端子导电接触，并且以平面方式弹性变形以与基板的表面接触。 密封树脂填充在凸起电极和端子之间的导电接触部分周围，以保持凸起电极和端子。

公开(公告)号：US20050230773A1

公开(公告)日：2005-10-20

申请号：US11103412

申请日：2005-04-11

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/485 ,  H01L31/0203

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

摘要翻译： 一种电子部件，其通过活性表面上的焊盘与相对基板电连接，其特征在于，所述有源面上的树脂凸块和所述树脂凸块上的导电膜构成凸起电极，并且多个凸块电极为电气 连接到一个垫。

公开(公告)号：US08508042B2

公开(公告)日：2013-08-13

申请号：US13015011

申请日：2011-01-27

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L23/485

CPC分类号： H01L24/13 ,  G02F1/1345 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.

公开(公告)号：US08183693B2

公开(公告)日：2012-05-22

申请号：US12897173

申请日：2010-10-04

申请人： Shuichi Tanaka ,  Haruki Ito

发明人： Shuichi Tanaka ,  Haruki Ito

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device includes n1 first interconnects (n is an integer larger than one) respectively formed on first electrodes and extending over a first resin protrusion, and n2 second interconnects (n2

摘要翻译： 半导体器件包括分别形成在第一电极上并在第一树脂突起上延伸的n1个第一互连（n是大于一的整数），以及分别形成在第二电极上并在第二树脂突起上延伸的n2个第二互连（n2 < 。 第一和第二树脂突起由相同的材料形成，具有相同的宽度并且纵向延伸。 第一互连延伸以与第一树脂突起的纵向轴线相交，并且每个第一互连件在第一树脂突起上具有第一宽度W1。 第二互连延伸以与第二树脂突起的纵向轴线相交，并且每个第二互连件在第二树脂突起上具有第二宽度W2（W1

公开(公告)号：US07341335B2

公开(公告)日：2008-03-11

申请号：US11233117

申请日：2005-09-23

申请人： Fujio Akahane ,  Hisashi Miyazawa ,  Shuichi Tanaka

发明人： Fujio Akahane ,  Hisashi Miyazawa ,  Shuichi Tanaka

IPC分类号： B41J2/175

CPC分类号： B41J2/17509 ,  B41J2/17523 ,  B41J2/17596

摘要： A liquid ejection apparatus ejects liquid retained in a liquid container from a liquid ejection head. The apparatus includes a liquid supply needle having an outlet line that can be connected to the interior of the liquid container, a liquid supply line connecting the outlet line of the liquid supply needle to the recording head, and a control valve provided in the liquid supply line. The control valve closes the liquid supply line when negative pressure is applied to the liquid ejection head. A seal valve is arranged between the control valve and the liquid supply needle in the liquid supply line. The seal valve seals the liquid supply line using liquid pressure applied from the control valve to the outlet line. Accordingly, the liquid is prevented from leaking from the liquid supply needle when the liquid container is separated from the liquid supply needle.

摘要翻译： 液体喷射装置从液体喷射头喷射保留在液体容器中的液体。 该装置包括：液体供给针，具有能够连接到液体容器的内部的出口管，将液体供给针的出口管连接到记录头的液体供给管;以及设置在液体供给部中的控制阀 线。 当向液体喷射头施加负压时，控制阀关闭液体供应管线。 密封阀配置在液体供给管路中的控制阀与液体供给针之间。 密封阀使用从控制阀施加到出口管线的液体压力来密封液体供应管线。 因此，当液体容器与液体供给针分离时，防止液体从液体供给针泄漏。

公开(公告)号：US20070029672A1

公开(公告)日：2007-02-08

申请号：US11497578

申请日：2006-08-02

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a straight line, and extending in a direction which intersects the straight line; and a plurality of electrical connection sections formed on the resin protrusions and electrically connected to the electrodes.

摘要翻译： 一种半导体器件，包括：形成有多个电极的半导体衬底; 形成在所述半导体基板上的多个树脂突起，沿着直线配置并沿与所述直线相交的方向延伸; 以及形成在所述树脂突起上并电连接到所述电极的多个电连接部。

公开(公告)号：US20070007671A1

公开(公告)日：2007-01-11

申请号：US11481332

申请日：2006-07-05

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L23/28

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014

摘要： A semiconductor device including a semiconductor substrate having a plurality of electrodes, a resin protrusion formed on the semiconductor substrate, and an interconnect electrically connected to the electrodes and formed to extend over the resin protrusion. A depression is formed in a top surface of the resin protrusion. The interconnect has a cut portion disposed over at least part of the depression.

摘要翻译： 一种半导体器件，包括具有多个电极的半导体衬底，形成在所述半导体衬底上的树脂突起，以及与所述电极电连接并形成为在所述树脂突起上延伸的互连。 在树脂突起的上表面形成有凹陷部。 互连具有设置在凹部的至少一部分上的切割部分。

公开(公告)号：US06779624B2

公开(公告)日：2004-08-24

申请号：US10434638

申请日：2003-05-12

申请人： Atsutoshi Goto ,  Hiroshi Sakamoto ,  Yasuhiro Yuasa ,  Shuichi Tanaka ,  Shigeru Muraoka ,  Masakuni Tanaka

发明人： Atsutoshi Goto ,  Hiroshi Sakamoto ,  Yasuhiro Yuasa ,  Shuichi Tanaka ,  Shigeru Muraoka ,  Masakuni Tanaka

IPC分类号： B62D506

CPC分类号： B62D5/09

摘要： In a control unit for use with a power steering apparatus, there are provided and integrated into a single body, a main operating fluid feed device for supplying the hydraulic cylinder with an amount of oil corresponding to the amount of rotation of the steering wheel H, an auxiliary operating fluid feed device for supplying a correcting oil for adjusting drive of said hydraulic cylinder according to control signal, and a steering wheel angle sensor disposed around the rotating shaft of the steering wheel connected to said main operating fluid feed device, to detect steering wheel angle corresponding to the rotating position of said steering wheel.