A drive circuit module capable of dissipating heat produced by a semiconductor device, in the form of a bare chip, and in which the semiconductor device can be driven in a floating state, and a display device in which the drive circuit module is mounted have been disclosed. The drive circuit module comprises a heat dissipation plate, a flexible circuit board, an insulation layer having a wiring pattern, a semiconductor device mounting insulation layer, and a semiconductor device mounted on the heat dissipation plate via the semiconductor device mounting insulation layer, in which the insulation layer having the wiring pattern and the semiconductor device mounting insulation layer are made of a non-conductive resin, the flexible circuit board and the insulation layer having the wiring pattern are fixed on the heat dissipation plate directly or indirectly, and the semiconductor device is electrically connected to the wiring pattern and the flexible circuit board.