发明申请
- 专利标题: High density plate filler
- 专利标题(中): 高密度板填料
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申请号: US11086273申请日: 2005-03-22
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公开(公告)号: US20050232822A1公开(公告)日: 2005-10-20
- 发明人: Mark Reed , Albert Carrillo , Ian Harding
- 申请人: Mark Reed , Albert Carrillo , Ian Harding
- 主分类号: B01L3/00
- IPC分类号: B01L3/00 ; B01L7/00 ; B01L9/00 ; B01L99/00 ; G01N21/27 ; G01N21/64 ; G01N33/00 ; G01N35/02
摘要:
A filling apparatus for filling a microplate. The microplate can comprise a plurality of wells each sized to receive an assay. A substrate can comprise a first surface and an opposing second surface, a first assay input port for receiving the assay disposed on the first surface, a plurality of staging capillaries extending through the substrate, and a first plurality of microfluidic channels fluidly coupling the first assay input port with at least one of the plurality of staging capillaries. Each of the plurality of staging capillaries can comprise an inlet and an outlet and be sized to receive the assay.
公开/授权文献
- US07695688B2 High density plate filler 公开/授权日:2010-04-13
信息查询
IPC分类: