发明申请
- 专利标题： Substrate treating apparatus
- 专利标题（中）： 底物处理装置
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申请号： US10524215申请日： 2003-08-20
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公开(公告)号： US20050235918A1公开(公告)日： 2005-10-27
- 发明人: Yasuhiko Kojima , Tadahiro Ishizaka , Yumiko Kawano
- 申请人： Yasuhiko Kojima , Tadahiro Ishizaka , Yumiko Kawano
- 优先权： JP2002-252267 20020830
- 国际申请： PCT/JP03/10506 WO 20030820
- 主分类号： F25D9/00
- IPC分类号： F25D9/00 ; C23C16/44 ; C23C16/458 ; C23C16/46 ; H01L21/00 ; H01L21/205 ; H01L21/285 ; C23C16/00
摘要：
A substrate treating apparatus comprising a treatment chamber for housing a substrate, a stage on which the substrate is placed within the treatment chamber, a heating member arranged within the stage and used for heating the substrate, a sealing member arranged between the stage and the treatment chamber, and a cooling mechanism having a cooling medium, whose latent heat of vaporization is utilized for cooling the sealing member.