发明申请
- 专利标题: Substrate processing unit, method of detecting end point of cleaning of substrate processing unit, and method of detecting end point of substrate processing
- 专利标题(中): 衬底处理单元,检测衬底处理单元的清洁终点的方法以及检测衬底处理终点的方法
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申请号: US10525797申请日: 2003-08-28
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公开(公告)号: US20050241761A1公开(公告)日: 2005-11-03
- 发明人: Hiroshi Kannan , Tadahiro Ishizaka , Yasuhiko Kojima , Yasuhiro Oshima , Takashi Shigeoka
- 申请人: Hiroshi Kannan , Tadahiro Ishizaka , Yasuhiko Kojima , Yasuhiro Oshima , Takashi Shigeoka
- 申请人地址: JP Tokyo 107-8481
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo 107-8481
- 优先权: JP2002-252270 20020830
- 国际申请: PCT/JP03/10939 WO 20030828
- 主分类号: C23C16/44
- IPC分类号: C23C16/44 ; C23C16/52 ; H01L21/00 ; H01L21/205 ; H01L21/66 ; B08B7/04 ; C23F1/00
摘要:
A substrate processing unit comprises a processing vessel for receiving a substrate, a cleaning gas supply system for supplying cleaning gas to the processing vessel so as to clean the interior of the processing vessel, an exhauster for exhausting the processing vessel, an operating state detector for detecting the operating state of the exhauster, and an end point detector for detecting the end point of the cleaning on the basis of the detection result from the operating state detector.
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