发明申请
- 专利标题： Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
- 专利标题（中）： 保持电子部件锡表面的可焊性和抑制晶须生长
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申请号： US10968500申请日： 2004-10-19
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公开(公告)号： US20050249969A1公开(公告)日： 2005-11-10
- 发明人: Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph Abys , Eric Walch , Marlies Kleinfeld , Hans Eckert
- 申请人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph Abys , Eric Walch , Marlies Kleinfeld , Hans Eckert
- 专利权人： Enthone Inc.
- 当前专利权人： Enthone Inc.
- 主分类号： B32B15/01
- IPC分类号： B32B15/01 ; C25D5/10 ; C25D5/12 ; H01G4/228 ; H01L23/495
摘要：
A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 μm and about 4.0 μm in thickness. There is a nickel-phosphorus layer under the tin coating.
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