发明申请
- 专利标题： Resin-molded package with cavity structure
- 专利标题（中）： 具有腔体结构的树脂模制包装
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申请号： US11186794申请日： 2005-07-22
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公开(公告)号： US20050253227A1公开(公告)日： 2005-11-17
- 发明人: Hiroyuki Shoji
- 申请人： Hiroyuki Shoji
- 申请人地址： JP KAWASAKI-SHI
- 专利权人： NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- 当前专利权人： NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- 当前专利权人地址： JP KAWASAKI-SHI
- 优先权： JP2001-137611 20010508
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/02 ; H01L23/08 ; H01L23/10 ; H01L23/498 ; H01L23/34
摘要：
A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.
公开/授权文献
- US07187073B2 Resin-molded package with cavity structure 公开/授权日：2007-03-06
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