摘要:
An LED drive circuit is an LED dive circuit that receives an alternating voltage to drive an LED, and includes a current remove portion that removes a current from a current supply line that supplies an LED drive current to the LED. If an input current to the LED drive circuit is an unnecessary current, the LED does not light because of current removal by the current remove portion. If the input current to the LED drive circuit turns into the LED drive current from the unnecessary current, the current remove portion decreases the amount of current removed.
摘要:
Sufficient meta-information related to live content is favorably provided to devices.An expanded CDS for content information being delivered is defined, which is used for including detailed content information of content being delivered, separately from a standard CDS accessed during content browsing. In the expanded CDS for content information being delivered, a container is provided for each client of delivery destination, and a content node being delivered is arranged under the each delivery destination container node. A rule related to the expanded CDS for content information being delivered is shared with the client, so that the client can identify information of the expanded CDS for content information being delivered of the content that the client itself is reproducing.
摘要:
A bi-directional DC-DC converter has a transformer for connecting a voltage type full bridge circuit connected to a first power source and a current type switching circuit connected to a second power source. A voltage clamping circuit constructed by switching elements and a clamping capacitor is connected to the current type switching circuit. The converter has a control circuit for cooperatively making switching elements operative so as to control a current flowing in a resonance reactor.
摘要:
Disclosed is a small-size, high-efficiency, isolated, bidirectional DC-DC converter. The bidirectional DC-DC converter includes a transformer in which windings are magnetically coupled, switching circuits, a diode which is connected in parallel with a switch, smoothing capacitors, and a control section. First and second DC power supplies, which are connected in parallel with the smoothing capacitors, respectively, provide bidirectional electrical power transfer. When electrical power is to be transferred from the first DC power supply to the second DC power supply, the switch is maintained in the ON state. When, on the other hand, electrical power is to be transferred from the second DC power supply to the first DC power supply, the switch is maintained in the OFF state to prevent a reverse electrical power flow from the first DC power supply.
摘要:
The DC-DC converter connects a first and a second switching circuit for converting power mutually between direct current and alternating current respectively to a first DC power source and a second DC power source and has a transformer between the AC terminals thereof. Here, between the AC terminals of the second switching circuit and the negative pole terminal of the DC power source, a voltage clamp circuit composed of a series unit of switching devices with a reverse parallel diode and a clamp condenser is connected.An isolated bidirectional DC-DC converter which prevents a reduction in a circulating current at time of buck and an occurrence of a surge voltage at time of voltage boost and realizes highly efficiency, low noise, and miniaturization is provided.
摘要:
A soft switching DC-DC converter is provided which includes circuitry for both a buck converter and a boost converter. The buck converter circuitry and the boost converter circuitry share a common transformer including a primary coil and first and second secondary coils. A first switching element is coupled to a first capacitor to provide the buck converter operation while another switching element is provided to provide the boost converting operation. The primary coil of the transformer is commonly used as a choke coil by both the buck converter and the boost converter. In this way, size and cost reduction can be obtained.
摘要:
A bi-directional DC-DC converter has a transformer for connecting a voltage type full bridge circuit connected to a first power source and a current type switching circuit connected to a second power source. A voltage clamping circuit constructed by switching elements and a clamping capacitor is connected to the current type switching circuit. The converter has a control circuit for cooperatively making switching elements operative so as to control a current flowing in a resonance reactor.
摘要:
An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.).
摘要:
A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.
摘要:
A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.