Invention Application
US20050263721A1 Uniformity control using multiple tilt axes, rotating wafer and variable scan velocity
有权
使用多个倾斜轴,旋转晶片和可变扫描速度的均匀性控制
- Patent Title: Uniformity control using multiple tilt axes, rotating wafer and variable scan velocity
- Patent Title (中): 使用多个倾斜轴,旋转晶片和可变扫描速度的均匀性控制
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Application No.: US11021420Application Date: 2004-12-23
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Publication No.: US20050263721A1Publication Date: 2005-12-01
- Inventor: Anthony Renau , Joseph Olson , Donna Smatlak , Jun Lu
- Applicant: Anthony Renau , Joseph Olson , Donna Smatlak , Jun Lu
- Main IPC: G21K5/10
- IPC: G21K5/10 ; H01J37/08

Abstract:
A system, method and program product for enhancing dose uniformity during ion implantation are disclosed. The present invention is directed to allowing the use of an at least partially untuned ion beam to obtain a uniform implant by scanning the beam in multiple rotationally-fixed orientations (scan directions) of the target at variable or non-uniform scan velocities. The non-uniform scan velocities are dictated by a scan velocity profile that is generated based on the ion beam profile and/or the scan direction. The beam can be of any size, shape or tuning. A platen holding a wafer is rotated to a new desired rotationally-fixed orientation after a scan, and a subsequent scan occurs at the same scan velocity profile or a different scan velocity profile. Also included is a method, system and program product for conducting a uniform dose ion implantation in which the target is rotated and tilted about greater than one axes relative to the ion beam.
Public/Granted literature
- US07166854B2 Uniformity control multiple tilt axes, rotating wafer and variable scan velocity Public/Granted day:2007-01-23
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