Invention Application
US20050264798A1 Method and its apparatus for inspecting particles or defects of a semiconductor device
有权
用于检查半导体器件的颗粒或缺陷的方法及其装置
- Patent Title: Method and its apparatus for inspecting particles or defects of a semiconductor device
- Patent Title (中): 用于检查半导体器件的颗粒或缺陷的方法及其装置
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Application No.: US11190838Application Date: 2005-07-28
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Publication No.: US20050264798A1Publication Date: 2005-12-01
- Inventor: Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
- Applicant: Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ohshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
- Priority: JP2001-288013 20010921; JP2000-291952 20000921
- Main IPC: G01N21/27
- IPC: G01N21/27 ; G01N21/47 ; G01N21/88 ; G01N21/94 ; G01N21/95
Abstract:
An apparatus for optically inspecting particles and/or defects correlates sizes of particles and/or defects to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.
Public/Granted literature
- US07262425B2 Method and its apparatus for inspecting particles or defects of a semiconductor device Public/Granted day:2007-08-28
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