Method and its apparatus for inspecting particles or defects of a semiconductor device
    8.
    发明申请
    Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
    用于检查半导体器件的颗粒或缺陷的方法及其装置

    公开(公告)号:US20050024633A1

    公开(公告)日:2005-02-03

    申请号:US10933977

    申请日:2004-09-03

    IPC分类号: G01N21/88 G01N21/94

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。

    Method and its apparatus for inspecting particles or defects of a semiconductor device
    9.
    发明授权
    Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
    用于检查半导体器件的颗粒或缺陷的方法及其装置

    公开(公告)号:US08072597B2

    公开(公告)日:2011-12-06

    申请号:US12138889

    申请日:2008-06-13

    IPC分类号: G01N15/02

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。