发明申请
- 专利标题： Adhesive patch
- 专利标题（中）： 胶贴
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申请号： US11141727申请日： 2005-05-31
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公开(公告)号： US20050266063A1公开(公告)日： 2005-12-01
- 发明人: Takashi Yasukochi , Tetsuro Tateishi , Naruhito Higo
- 申请人： Takashi Yasukochi , Tetsuro Tateishi , Naruhito Higo
- 申请人地址： JP Saga 841-0017
- 专利权人： Hisamitsu Pharmaceutical Co., Inc.
- 当前专利权人： Hisamitsu Pharmaceutical Co., Inc.
- 当前专利权人地址： JP Saga 841-0017
- 优先权： JP2004-163286 20040601
- 主分类号： A61K9/70
- IPC分类号： A61K9/70
摘要：
The present invention relates an adhesive patch comprising a backing layer and an adhesive layer that contains a drug, wherein the adhesive layer contains a mixed adhesive base containing a hydrocarbon rubber and a silicon-containing polymer. The adhesive patch of the invention shows extremely superior skin absorbability of a drug in a preparation, reduced skin irritation, and excellent aging stability of the drug in the preparation, and can achieve easiness of drug-taking methods and improvement in compliance.
公开/授权文献
- US08173155B2 Adhesive patch 公开/授权日：2012-05-08