发明申请
- 专利标题： Method of varying dimensions of a substrate during nano-scale manufacturing
- 专利标题（中）： 纳米级制造过程中衬底尺寸变化的方法
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申请号： US11142834申请日： 2005-06-01
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公开(公告)号： US20050269745A1公开(公告)日： 2005-12-08
- 发明人: Anshuman Cherala , Byung-Jin Choi , Pawan Nimmakayala , Mario Meissl , Sidlgata Sreenivasan
- 申请人： Anshuman Cherala , Byung-Jin Choi , Pawan Nimmakayala , Mario Meissl , Sidlgata Sreenivasan
- 专利权人： Molecular Imprints, Inc.
- 当前专利权人： Molecular Imprints, Inc.
- 主分类号： B29C43/02
- IPC分类号： B29C43/02 ; B81C99/00 ; G03B27/58 ; G03F7/00
摘要：
The present invention is directed toward a method to vary dimensions of a substrate supported by a chuck. The method includes applying compressive forces to the substrate with the actuator assembly while facilitating movement of the actuator assembly with respect to the substrate to minimize reactive forces generated in response to the compressive forces being sensed by the chuck.
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