发明申请
- 专利标题: Semi-compliant joining mechanism for semiconductor cooling applications
- 专利标题(中): 半合规半导体冷却应用的连接机制
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申请号: US10945807申请日: 2004-09-20
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公开(公告)号: US20050270742A1公开(公告)日: 2005-12-08
- 发明人: Richard Brewer , Paul Tsao , Richard Herms , Mark Munch , Mark McMaster , Dave Corbin
- 申请人: Richard Brewer , Paul Tsao , Richard Herms , Mark Munch , Mark McMaster , Dave Corbin
- 专利权人: Cooligy, Inc.
- 当前专利权人: Cooligy, Inc.
- 主分类号: H01L23/40
- IPC分类号: H01L23/40 ; H01L23/473 ; H05K7/20
摘要:
A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
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