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    Channeled flat plate fin heat exchange system, device and method
    2.
    发明授权
    Channeled flat plate fin heat exchange system, device and method 有权
    通风平板翅片换热系统，装置及方法

    公开(公告)号：US06988535B2

    公开(公告)日：2006-01-24

    申请号：US10699505

    申请日：2003-10-30

    申请人： Girish Upadhya ,  Richard Herms ,  Peng Zhou ,  Kenneth Goodson

    发明人： Girish Upadhya ,  Richard Herms ,  Peng Zhou ,  Kenneth Goodson

    IPC分类号： F28F7/00

    CPC分类号： F28F3/02 ,  F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/10 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.

    摘要翻译： 公开了一种用于流体冷却通道式热交换装置的装置，方法和系统。 流体冷却通道热交换装置利用通过通道热交换器循环的流体，用于高散热和每单位体积的传递面积。 该装置包括高导热性材料，优选小于200W / m-K。 优选的通道热交换器包括两个联接的平板和耦合到平板的多个翅片。 至少一个板优选地接收处于加热状态的流体的流动。 流体优选地承载来自热源（例如CPU）的热量。 具体地，至少一个板优选地包括多个冷凝器通道，其构造成在加热状态下接收，冷凝和冷却流体。 处于较冷状态的流体优选从装置运送到热源，从而冷却热源。

    Semi-compliant joining mechanism for semiconductor cooling applications
    3.
    发明申请
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US20050270742A1

    公开(公告)日：2005-12-08

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Semi-compliant joining mechanism for semiconductor cooling applications
    5.
    发明授权
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US07301773B2

    公开(公告)日：2007-11-27

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。