发明申请
- 专利标题: Thermal activation device
- 专利标题(中): 热激活装置
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申请号: US11137841申请日: 2005-05-25
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公开(公告)号: US20050274706A1公开(公告)日: 2005-12-15
- 发明人: Minoru Hoshino , Yoshinori Sato , Hiroyuki Kohira , Masanori Takahashi , Tatsuya Obuchi
- 申请人: Minoru Hoshino , Yoshinori Sato , Hiroyuki Kohira , Masanori Takahashi , Tatsuya Obuchi
- 优先权: JP2004-163091 20040601
- 主分类号: B65C9/24
- IPC分类号: B65C9/24 ; B41J2/32 ; B65C9/25 ; G09F3/00 ; G09F3/10 ; H05B3/00 ; B65H1/08 ; H05B1/00 ; H05B11/00
摘要:
Provided is a thermal activation device including a thermal activation head (11) for thermally activating a heat-sensitive adhesive layer of a sheet material (3) having a printing layer provided on one surface of a sheet-like base material and having the heat-sensitive adhesive layer provided on the other surface thereof, and a platen roller (12) for holding and conveying the sheet material (3), the platen roller (12) being brought into press contact with the thermal activation head (11). Moreover, the thermal activation head (11) thermally activates the heat-sensitive adhesive layer asymmetrically with respect to a centerline in a width direction perpendicular to a conveying direction of the sheet material (3). Furthermore, a plate spring (18) which urges the sheet material (3) to be pressed onto a peripheral surface of the platen roller (12) is provided, the plate spring (18) being located on an upstream side of the thermal activation head (11) in the conveying direction of the sheet material (3).
公开/授权文献
- US07248273B2 Thermal activation device 公开/授权日:2007-07-24
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