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    LINERLESS THERMOSENSITIVE RECORDING BODY PACKAGE
    1.
    发明申请
    LINERLESS THERMOSENSITIVE RECORDING BODY PACKAGE 审中-公开

    公开(公告)号：US20200023663A1

    公开(公告)日：2020-01-23

    申请号：US16493559

    申请日：2018-03-12

    申请人： Tohru KITANO ,  Tomohisa KAKUDA ,  Hiroaki MATSUI

    发明人： Tohru KITANO ,  Tomohisa KAKUDA ,  Hiroaki MATSUI

    IPC分类号： B41M5/44 ,  B65C9/25

    摘要： Provided is a linerless thermosensitive recording body package, a roll of a linerless thermosensitive recording sheet being packaged in the linerless thermosensitive recording body package, the linerless thermosensitive recording sheet including a support, a thermosensitive color developing layer over one surface of the support, a release layer over the thermosensitive color developing layer, and an adhesive layer over an opposite surface of the support, the linerless thermosensitive recording sheet being wound in roll shape in a manner that the adhesive layer comes to an internal side of the support, wherein a peel force for peeling the linerless thermosensitive recording sheet from the roll is 50 mN/50 mm or greater but 250 mN/50 mm or less, wherein a water content of the linerless thermosensitive recording sheet is 4.5% or higher but 6.5% or lower, the roll of the linerless thermosensitive recording sheet being seal-packaged in the linerless thermosensitive recording body package.

    Heat transfer labeling machine with hot air treatment stations
    4.
    发明授权
    Heat transfer labeling machine with hot air treatment stations 有权
    热转印贴标机，热风处理站

    公开(公告)号：US08986475B2

    公开(公告)日：2015-03-24

    申请号：US13161608

    申请日：2011-06-16

    申请人： Bruce A. Ense ,  John T. Martin

    发明人： Bruce A. Ense ,  John T. Martin

    IPC分类号： B32B41/00 ,  B65C9/25

    CPC分类号： B65C9/25 ,  Y10T156/10

    摘要： A transfer label machine has a post treatment station for exposing newly applied labels to heat in order to finish and gloss out the label. The heat is applied through a nozzle coupled to a hot air supply system that includes a blower, ductwork, and a heating element disposed in the airflow. A temperature probe measures temperature of the air flow and an IR sensor measures the resulting temperature of containers on which the labels have been applied. A programmable logic controller (PLC) is programmed with proportional integral derivative (PID) algorithms to control the blower speed and the heating element to provide the appropriate amount of heat for the labeling or processing speed at which the labeling machine is operating. A vision system can confirm the quality of label after the post treatment heating. In the event of a machine jam, the blower and/or heating element can be turned off or the air can be shunted away from the containers to reduce greatly the likelihood of a fire, which has occurred with prior art flame based post treatment heating units.

    摘要翻译： 转印标签机器具有用于将新应用的标签曝光以加热的后处理站，以便完成并涂抹标签。 通过连接到热空气供应系统的喷嘴施加热量，所述喷嘴包括鼓风机，管道系统和设置在气流中的加热元件。 温度探头测量空气流量的温度，IR传感器测量已经施加标签的容器的最终温度。 可编程逻辑控制器（PLC）用比例积分微分（PID）算法编程，以控制鼓风机速度和加热元件，为贴标机器运行的标签或处理速度提供适当的热量。 视觉系统可以确认后处理加热后的标签质量。 在机器堵塞的情况下，可以关闭吹风机和/或加热元件，或者将空气从容器中分流，以大大减少现有技术的基于火焰的后处理加热单元发生的火灾的可能性 。

    Method of manufacturing replica diffraction grating
    7.
    发明授权
    Method of manufacturing replica diffraction grating 失效
    制造复制衍射光栅的方法

    公开(公告)号：US07501035B2

    公开(公告)日：2009-03-10

    申请号：US11149242

    申请日：2005-06-10

    申请人： Ryo Tateno

    发明人： Ryo Tateno

    IPC分类号： B44C1/175 ,  B32B27/06 ,  B32B27/16 ,  B32B37/10 ,  B32B37/12 ,  B32B37/14 ,  C09J5/04 ,  B29C44/06 ,  B29C65/48 ,  C08J7/04 ,  B32B37/06 ,  B32B37/16 ,  B65C9/25 ,  H01L21/302

    CPC分类号： G02B5/1852

    摘要： A method of manufacturing a replica diffraction grating includes the steps of: forming a metal thin film on a grating surface of a master diffraction grating, adhering a replica substrate to the metal thin film via an adhesive, and removing the replica substrate so that the metal thin film in a reverse state is adhered on the replica substrate. In the method, before forming the metal thin film on the grating surface of the master diffraction grating, the grating surface is coated with a fluorine surface treating agent as a release agent. Then, the metal thin film is formed with vacuum vapor deposition.

    摘要翻译： 制造复制衍射光栅的方法包括以下步骤：在主衍射光栅的光栅表面上形成金属薄膜，通过粘合剂将复制基板粘附到金属薄膜上，并移除复制基板，使金属 反向状态的薄膜粘附在复制基板上。 在该方法中，在主衍射光栅的光栅表面上形成金属薄膜之前，光栅表面涂覆有氟表面处理剂作为脱模剂。 然后，通过真空气相沉积形成金属薄膜。

    Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip
    8.
    发明申请
    Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip 审中-公开
    带内置IC芯片的胶带，其制作方法和内置IC芯片的片材

    公开(公告)号：US20070259175A1

    公开(公告)日：2007-11-08

    申请号：US11575131

    申请日：2005-09-13

    申请人： Mitsuhiro Ayaki ,  Nobuo Kanda ,  Shiro Sugimura ,  Hideki Kobayashi ,  Tuyoshi Ozaki ,  Keitaro Tomita ,  Keiichi Utaka ,  Mitugi Saito

    发明人： Mitsuhiro Ayaki ,  Nobuo Kanda ,  Shiro Sugimura ,  Hideki Kobayashi ,  Tuyoshi Ozaki ,  Keitaro Tomita ,  Keiichi Utaka ,  Mitugi Saito

    IPC分类号： A01K1/015 ,  B65C9/25

    CPC分类号： G06K19/07 ,  G07D7/01 ,  Y10T428/249921 ,  Y10T428/2848

    摘要： The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC chip. The tape with at least one built-in IC chip is characterized in that a part or all of the IC chip 10 is embedded in a recessed portion 20a formed on a tape body, and the tape body 20 includes: a first base material 21; an adhesive layer 22 laminated on the first base material and formed of an adhesive; and a second base material 23 laminated on the adhesive layer; the second base material 23 being removed from the recessed portion 20a and the periphery thereof, and the adhesive in the recessed portion 20a of the adhesive layer 22 being pushed to the periphery thereof, and the pushed adhesive filling in a gap between the periphery of the IC chip 10 and the second base material 23.

    摘要翻译： 本发明涉及具有至少一个内置IC芯片的片材，该片材几乎不受机械外力的影响并且不会损失或损坏IC芯片，并且涉及具有至少一个内置IC芯片的带， 在IC芯片中用于具有至少一个内置IC芯片的片材。 具有至少一个内置IC芯片的带的特征在于，IC芯片10的一部分或全部嵌入形成在带体上的凹部20a中，带体20包括：第一基材21 ; 层压在第一基材上并由粘合剂形成的粘合剂层22; 和层叠在粘合剂层上的第二基材23; 第二基材23从凹部20a及其周边除去，粘合剂层22的凹部20a中的粘合剂被推到其周围，并且被挤压的粘合剂填充在周边 的IC芯片10和第二基材23。