Disclosed is a wiring board, comprising: a rigid substrate having a first surface and a second surface, wiring layers on the first surface and the second surface, and through hole's inner wall conductors electrically conducting the wiring layers on the first and the second surface, the wiring layer on the first surface including part mounting lands; a flexible substrate disposed to oppose the second surface of the rigid substrate and having connection lands on its surface which is opposite to the second surface of the rigid substrate, the connection lands being positioned to substantially agree with positions of the through hole's inner wall conductors of the rigid substrate; and a connecting member which electrically and mechanically connects the through hole's inner wall conductors and the connection lands, and a magnetic disc apparatus having the wiring board and a production method of the wiring board are disclosed.