Invention Application
US20050280498A1 Conductive base material with resistance layer and circuit board material with resistance layer
审中-公开
具有电阻层的导电基材和具有电阻层的电路板材料
- Patent Title: Conductive base material with resistance layer and circuit board material with resistance layer
- Patent Title (中): 具有电阻层的导电基材和具有电阻层的电路板材料
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Application No.: US11153609Application Date: 2005-06-16
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Publication No.: US20050280498A1Publication Date: 2005-12-22
- Inventor: Yuuki Kikuchi , Akira Matsuda , Yuuji Suzuki , Sadao Matsumoto
- Applicant: Yuuki Kikuchi , Akira Matsuda , Yuuji Suzuki , Sadao Matsumoto
- Priority: JP2004-179797 20040617
- Main IPC: C25D3/56
- IPC: C25D3/56 ; C25D5/12 ; C25D5/16 ; C25D7/06 ; H05K1/16 ; H05K3/38 ; H01C1/012
Abstract:
A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 μm and the resistance layer of Ni alloy layer containing at least 8 to 18 wt % of P is formed on the roughening treated side.
Information query
