公开(公告)号：US12104271B2

公开(公告)日：2024-10-01

申请号：US18215740

申请日：2023-06-28

申请人： TOYO KOHAN CO., LTD.

发明人： Hiroki Yanaga ,  Shinichirou Horie ,  Etsuro Tsutsumi ,  Masashi Ichishima ,  Toshifumi Koyanagi ,  Koh Yoshioka

IPC分类号： C25D5/16 ,  B32B15/01 ,  C25D5/12

CPC分类号： C25D5/16 ,  B32B15/013 ,  B32B15/017 ,  C25D5/12 ,  B32B2307/538

摘要： A roughened plated sheet including a roughened plated layer having a roughened nickel plated layer and a zinc plated layer formed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rzjis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more, and the metal substrate is a steel sheet.

公开(公告)号：US11952675B2

公开(公告)日：2024-04-09

申请号：US17787847

申请日：2020-11-10

申请人： NIPPON DENKAI, LTD.

发明人： Toshio Kawasaki ,  Yasuhiro Endo

IPC分类号： C25D5/12 ,  C23C28/00 ,  C25D5/00 ,  C25D5/16 ,  C25D5/48 ,  C25D7/06 ,  H05K1/09 ,  H05K3/38

CPC分类号： C25D5/12 ,  C23C28/30 ,  C25D5/16 ,  C25D5/48 ,  C25D5/605 ,  C25D7/0614 ,  H05K1/09 ,  H05K3/384 ,  Y10T428/12438

摘要： Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

公开(公告)号：US20240084472A1

公开(公告)日：2024-03-14

申请号：US18263655

申请日：2021-02-05

申请人： Heraeus Materials Singapore Pte. Ltd. ,  Heraeus Deutschland GmbH & Co. KG

发明人： Murali SARANGAPANI ,  Yee Weon LIM ,  Wai Khee SEE THO ,  Mariyappan DHAYALAN ,  Chee Chow TAN ,  Juergen SCHARF ,  Sungsig KANG

IPC分类号： C25D5/12 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/16 ,  C25D5/50 ,  C25D7/06

CPC分类号： C25D5/12 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/16 ,  C25D5/50 ,  C25D7/0607

摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤40 wt.-ppm.

公开(公告)号：US11896945B2

公开(公告)日：2024-02-13

申请号：US16597799

申请日：2019-10-09

申请人： MICROSOFT TECHNOLOGY LICENSING, LLC

发明人： Bichlien Hoang Nguyen ,  Karin Strauss ,  Hsing-Yeh Parker

IPC分类号： B01J19/00 ,  C07K1/04 ,  C25D17/10 ,  C25D5/48 ,  C25D5/16

CPC分类号： B01J19/0046 ,  C07K1/042 ,  C25D5/16 ,  C25D5/48 ,  C25D17/10 ,  B01J2219/0059 ,  B01J2219/00497 ,  B01J2219/00596 ,  B01J2219/00612 ,  B01J2219/00722 ,  B01J2219/00725

摘要： High surface area coatings are applied to solid substrates to increase the surface area available for solid-phase synthesis of polymers. The high surface area coatings use three-dimensional space to provide more area for functional groups to bind polymers than an untreated solid substrate. The polymers may be oligonucleotides, polypeptides, or another type of polymer. The solid substrate is a rigid supportive layer made from a material such as glass, a silicon material, a metal material, and plastic. The coating may be thin films, hydrogels, microparticles. The coating may be made from a metal oxide, a high-κ dielectric, a low-κ dielectric, an etched metal, a carbon material, or an organic polymer. The functional groups may be hydroxyl groups, amine groups, thiolate groups, alkenes, n-alkenes, alkalines, N-Hydroxysuccinimide (NHS)-activated esters, polyaniline, aminosilane groups, silanized oxides, oligothiophenes, and diazonium compounds. Techniques for applying coatings to solid substrates and attaching functional groups are also disclosed.

公开(公告)号：US20230340685A1

公开(公告)日：2023-10-26

申请号：US18215740

申请日：2023-06-28

申请人： TOYO KOHAN CO., LTD.

发明人： Hiroki YANAGA ,  Shinichirou HORIE ,  Etsuro TSUTSUMI ,  Masashi ICHISHIMA ,  Toshifumi KOYANAGI ,  Koh YOSHIOKA

IPC分类号： C25D5/16 ,  B32B15/01 ,  C25D5/12

CPC分类号： C25D5/16 ,  B32B15/013 ,  B32B15/017 ,  C25D5/12 ,  B32B2307/538

摘要： A roughened plated sheet including a roughened plated layer having a roughened nickel plated layer and a zinc plated layer formed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rzjis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more, and the metal substrate is a steel sheet.

公开(公告)号：US11732376B2

公开(公告)日：2023-08-22

申请号：US17596362

申请日：2020-06-10

申请人： TOYO KOHAN CO., LTD.

发明人： Hiroki Yanaga ,  Shinichirou Horie ,  Etsuro Tsutsumi ,  Masashi Ichishima ,  Toshifumi Koyanagi ,  Koh Yoshioka

IPC分类号： B32B15/01 ,  C25D5/16 ,  C25D5/12

CPC分类号： C25D5/16 ,  B32B15/013 ,  B32B15/017 ,  C25D5/12 ,  B32B2307/538

摘要： Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer formed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rzjis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.

公开(公告)号：US20220235483A1

公开(公告)日：2022-07-28

申请号：US17596362

申请日：2020-06-10

申请人： TOYO KOHAN CO., LTD.

发明人： Hiroki YANAGA ,  Shinichirou HORIE ,  Etsuro TSUTSUMI ,  Masashi ICHISHIMA ,  Toshifumi KOYANAGI ,  Koh YOSHIOKA

IPC分类号： C25D5/16 ,  B32B15/01 ,  C25D5/12

摘要： Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer famed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rzjis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.

公开(公告)号：US11268204B2

公开(公告)日：2022-03-08

申请号：US16937289

申请日：2020-07-23

申请人： DONGGUAN LEADER PRECISION INDUSTRY CO., LTD

发明人： Guo-Dong Li ,  Li-Jun Xu ,  Xiao-Qing Zhang ,  Knight Zhang

IPC分类号： C25D7/00 ,  C25D3/12 ,  C25D3/46 ,  C25D3/48 ,  C25D5/12 ,  C25D5/34 ,  B32B3/26 ,  C25D5/02 ,  C25D5/16 ,  H01R13/03 ,  H01R13/02

摘要： A metallic terminal includes a terminal body, a first plating layer, a second plating layer, and a third plating layer. The first plating layer is on the terminal body, and the thickness of the first plating layer at the bent portion of the terminal body is 0.3 to 1.75 micrometers, and the thickness of rest portions of the first plating layer is 2 to 10 micrometers. The second plating layer is on the first plating layer and corresponds to the contact portion of the terminal body, and the thickness of the second plating layer is 0.5 to 2 micrometers. The third plating layer is on the first plating layer and corresponds to the soldering portion of the terminal body, and the thickness of the third plating layer is 0.01 to 0.1 micrometers. A manufacturing method of metallic terminal is also provided.

公开(公告)号：US20210309870A1

公开(公告)日：2021-10-07

申请号：US17347508

申请日：2021-06-14

申请人： Virginia Tech Intellectual Properties, Inc.

发明人： Atieh Haghdoost ,  Ranga Pitchumani ,  Mehdi Kargar

IPC分类号： C09D7/61 ,  B01J37/02 ,  B01J37/34 ,  B01J23/72 ,  C25D3/38 ,  C25D5/00 ,  C25D21/12 ,  B01J35/00 ,  B05D5/08 ,  C09D5/16 ,  C09D1/00 ,  C09D5/24 ,  C09D5/44 ,  C25D5/10 ,  C25D5/16 ,  C25D9/02

摘要： A method is provided for creating a porous coating on a surface of a substrate by electrodeposition. The substrate is a part of the cathode. An anode is also provided. A coating is deposited or disposed on the surface by applying a voltage that creates a plurality of porous structures on the surface to be coated. Continuing to apply a voltage creates additional porosity and causes portions of the attached porous structures to detach. A covering layer is created by applying a voltage that creates a thin layer that covers the attached porous structures and the detached portions which binds the porous structures and detached portions together.

公开(公告)号：US20210304952A1

公开(公告)日：2021-09-30

申请号：US17213622

申请日：2021-03-26

申请人： Intel Corporation

发明人： William J. Lambert ,  Mihir K. Roy ,  Mathew J. Manusharow ,  Yikang Deng

IPC分类号： H01F27/28 ,  H01F17/00 ,  H01F41/04 ,  C25D5/16 ,  C25D5/48 ,  C25D7/00 ,  H01F27/255 ,  H01F41/02

摘要： Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.